Small but mighty, semiconducting qubits are a promising area of research on the road to a fully functional quantum computer. Less than one square micron, thousands of these qubits could fit into the space taken up by one of the current industry-leading superconducting qubit platforms, such as IBM’s or Google’s.
For a quantum computer on the order of tens or hundreds of qubits, that size difference is insignificant. But to get to the millions or billions of qubits needed to use these computers to model quantum physical processes or fold a protein in a matter of minutes, the tiny size of the semiconducting qubits could become a huge advantage.
Except, says Nathan Holman, who graduated from UW–Madison physics professor Mark Eriksson’s group with a PhD in 2020 and is now a scientist with HRL Laboratories, “All those qubits need to be wired up. But the qubits are so small, so how do we get the lines in there?”
In a new study published in NPJ Quantum Information on September 9, Holman and colleagues applied flip chip bonding to 3D integrate superconducting resonators with semiconducting qubits for the first time, freeing up space for the control wires in the process. They then showed that the new chip performs as well as non-integrated ones, meaning that they solved one problem without introducing another.
If quantum computers are to have any chance of outperforming their classical counterparts, their individual qubit units need to be scalable so that millions of qubits can work together. They also need an error correction scheme such as the surface code, which requires a 2D qubit grid and is the current best-proposed scheme.